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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/04/2022
Application #:
16774642
Filing Dt:
01/28/2020
Publication #:
Pub Dt:
08/06/2020
Inventor:
Mikael Tuominen
Title:
Component Carrier With Blind Hole Filled With An Electrically Conductive Medium And Fulfilling A Minimum Thickness Design Rule
Assignment: 1
Reel/Frame:
052205/0055Recorded: 03/24/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/19/2020
Assignee:
NO. 5000 JIN DU ROAD
SHANGHAI, CHINA 201108
Correspondent:
SMITH TEMPEL BLAHA LLC DOCKETING DEPARTM
50 GLENLAKE PARKWAY
SUITE 340
ATLANTA, GA 30328

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