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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11149200
Issue Dt:
10/19/2021
Application #:
15781471
Filing Dt:
06/04/2018
Publication #:
20200263087
Pub Dt:
08/20/2020
Inventors:
Jin Uk LEE, Jung Hun LIM, Jae Wan PARK
Title:
COMPOSITION FOR ETCHING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
Assignment: 1
Reel/Frame:
047423/0757Recorded: 11/05/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LIM, JUNG HUN
Exec Dt:
10/08/2018
LEE, JIN UK
Exec Dt:
10/08/2018
PARK, JAE WAN
Exec Dt:
10/08/2018
Assignee:
SOULBRAIN CO., LTD.
34, PANGYO-RO 255BEON-GIL, BUNDANG-GU
SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 13486
Correspondent:
JONGKOOK PARK
3949 PENDER DR.
SUITE 350
FAIRFAX, VA 22030
Assignment: 2
Reel/Frame:
051801/0444Recorded: 02/04/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LIM, JUNG HUN
Exec Dt:
10/08/2018
LEE, JIN UK
Exec Dt:
10/08/2018
PARK, JAE WAN
Exec Dt:
10/08/2018
Assignee:
SOULBRAIN CO., LTD.
34, PANGYO-RO 255BEON-GIL, BUNDANG-GU
SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 13486
Correspondent:
JONGKOOK PARK
3949 PENDER DR.
SUITE 350
FAIRFAX, VA 22030

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