Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/30/2021
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Application #:
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16454143
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Filing Dt:
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06/27/2019
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Publication #:
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Pub Dt:
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08/27/2020
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Inventors:
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LI-CHUN HUNG, CHIEN-CHEN LEE, HSIU-WEN TU
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Title:
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CHIP-SCALE SENSOR PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.84, TAI-HO RD., CHU-PEI |
| HSIN-CHU COUNTY, TAIWAN 302 |
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| LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
| 3057 NUTLEY STREET |
| SUITE 818 |
| FAIRFAX, VA 22031 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 6F., NO. 83, YANPING S. RD., ZHONGZHENG DIST. |
| TAIPEI CITY, TAIWAN 100011 |
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| MCCLURE, QUALEY & RODACK LLP |
| 280 INTERSTATE NORTH CIRCLE |
| SUITE 550 |
| ATLANTA, GA 30339 |
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