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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/30/2021
Application #:
16282207
Filing Dt:
02/21/2019
Publication #:
Pub Dt:
08/27/2020
Inventors:
Martin Gruber, Josef Hoeglauer, Michael Juerss, Josef Maerz, Thorsten Meyer et al
Title:
Clip Frame Assembly, Semiconductor Package Having a Lead Frame and a Clip Frame, and Method of Manufacture
Assignment: 1
Reel/Frame:
048570/0730Recorded: 03/12/2019Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/22/2019
Exec Dt:
02/22/2019
Exec Dt:
02/26/2019
Exec Dt:
02/22/2019
Exec Dt:
02/22/2019
Exec Dt:
02/22/2019
Exec Dt:
02/25/2019
Assignee:
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518
Assignment: 2
Reel/Frame:
048855/0214Recorded: 04/11/2019Pages: 11
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE DOCKET NUMBER PREVIOUSLY RECORDED ON REEL 048570 FRAME 0730. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
02/22/2019
Exec Dt:
02/22/2019
Exec Dt:
02/26/2019
Exec Dt:
02/22/2019
Exec Dt:
02/22/2019
Exec Dt:
02/22/2019
Exec Dt:
02/25/2019
Assignee:
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNOLOGIES
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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