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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16647125
Filing Dt:
03/13/2020
Publication #:
Pub Dt:
09/03/2020
Inventor:
Yuji MORIKAWA
Title:
WAFER SUPPORTING DEVICE
Assignment: 1
Reel/Frame:
052108/0231Recorded: 03/13/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/05/2020
Assignee:
5-2-20, AKASAKA, MINATO-KU
TOKYO, JAPAN 1076112
Correspondent:
TUTUNJIAN & BITETTO, P.C.
401 BROADHOLLOW ROAD
SUITE 402
MELVILLE, NY 11747

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