Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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07/06/2021
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Application #:
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16398746
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Filing Dt:
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04/30/2019
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Publication #:
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Pub Dt:
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09/03/2020
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Inventors:
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CHING-YU NI, HSIANG-HUA LU, YOUNG-WAY LIU
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Title:
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CHIP PACKAGING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 66, CHUNG SHAN ROAD, TU-CHENG DIST. |
| NEW TAIPEI, TAIWAN |
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| TUNG-YUN MCNALLY |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3F, NO.1, INNOVATION ROAD II, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 30076 |
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| CALVIN H CHAI |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 3732, SINO GERMAN ECO-PARK MAKER CENTER, NO. 172 TAIBAISHAN ROAD, QINGDAO AREA OF CHINA (SHANDONG) PILOT FREE TRADE ZONE |
| QINGDAO, CHINA |
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| CALVIN H CHAI |
| 550 S. HOPE STREET, STE 2825 |
| LOS ANGELES, CA 90071 |
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