Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/14/2021
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Application #:
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16651334
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Filing Dt:
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05/19/2020
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Publication #:
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Pub Dt:
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09/10/2020
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Inventors:
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Tomonori NAKAMURA, Toru MAEDA, Satoru NAGAI, Yoshihiro SAEKI, Osamu WATANABE
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Title:
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METHOD FOR SETTING CONDITIONS FOR HEATING SEMICONDUCTOR CHIP DURING BONDING, METHOD FOR MEASURING VISCOSITY OF NON-CONDUCTIVE FILM, AND BONDING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, |
| TOKYO, JAPAN 208-8585 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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