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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11630127
Issue Dt:
04/18/2023
Application #:
16839888
Filing Dt:
04/03/2020
Publication #:
20200292579
Pub Dt:
09/17/2020
Inventors:
Ming Ting Wu, Rulon J. Larsen III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar et al
Title:
Multi-Layer, Multi-Material Micro-Scale and Millimeter-Scale Devices with Enhanced Electrical and/or Mechanical Properties
Assignment: 1
Reel/Frame:
052901/0231Recorded: 06/10/2020Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WU, MING TING
Exec Dt:
12/15/2010
LARSEN, RULON JOSEPH, III
Exec Dt:
12/17/2010
KIM, YOUNG
Exec Dt:
12/17/2010
KIM, KIEUN
Exec Dt:
12/29/2010
COHEN, ADAM L.
Exec Dt:
12/23/2010
KUMAR, ANANDA H.
Exec Dt:
02/03/2011
LOCKARD, MICHAEL S.
Exec Dt:
12/15/2010
SMALLEY, DENNIS R.
Exec Dt:
12/09/2010
Assignee:
MICROFABRICA INC.
7911 HASKELL AVENUE
VAN NUYS, CALIFORNIA 91406
Correspondent:
DENNIS R. SMALLEY
7911 HASKELL AVENUE
VAN NUYS, CA 91406
Assignment: 2
Reel/Frame:
052901/0253Recorded: 06/10/2020Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
MICROFABRICA INC.
Exec Dt:
01/28/2016
Assignee:
UNIVERSITY OF SOUTHERN CALIFORNIA
1150 SOUTH OLIVE STREET
SUITE 2300
LOS ANGELES, CALIFORNIA 90015
Correspondent:
DENNIS R. SMALLEY
7911 HASKELL AVENUE
VAN NUYS, CA 91406

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