Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16814792
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Filing Dt:
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03/10/2020
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Publication #:
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Pub Dt:
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09/17/2020
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Inventors:
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Raymond Janik, Nilay Natwar Mehta, John Trublowski, Rajen Modi, Sridhar Reddy Nimma
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Title:
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Reducing Capacitive Coupling On Metal Core Boards
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HIGH TECH CAMPUS 48 |
| EINDHOVEN, NETHERLANDS 5656AE |
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| SIGNIFY INTELLECTUAL PROPERTY |
| 465 COLUMBUS AVENUE |
| SUITE 330 |
| VALHALLA, NY 10595 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HIGH TECH CAMPUS 48 |
| EINDHOVEN, NETHERLANDS 5656 AE |
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| SIGNIFY HOLDING B.V. |
| 465 COLUMBUS AVENUE |
| VALHALLA, NY 10595 |
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