Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/18/2022
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Application #:
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16649472
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Filing Dt:
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03/20/2020
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Publication #:
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Pub Dt:
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09/24/2020
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Inventors:
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Akira YASUE, Hideki CHIBA, Daisuke KUNIHIRO, Shoso NISHIDA, Kazuya TSUJI, Yasufumi FUJITA et al
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Title:
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MOLDING METHOD AND MOLDING APPARATUS OF MOLDED ARTICLE COMPRISING FIBER-REINFORCED THERMOPLASTIC RESIN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, OSAKI 1-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 1410032 |
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| SUGHRUE MION, PLLC. |
| 2000 PENNSYLVANIA AVE., NW. |
| 8TH FLOOR |
| WASHINGTON, DC 20006 |
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