Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
01/12/2021
|
Application #:
|
16413623
|
Filing Dt:
|
05/16/2019
|
|
Publication #:
|
|
Pub Dt:
|
09/24/2020
| | | | |
|
Inventors:
|
Sheng-Fan Yang, Yuan-Hung Lin, Yu-Cheng Sun
|
|
Title:
|
CIRCUIT STRUCTURE AND CHIP PACKAGE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO.10, LIXING 6TH RD., SCIENCE-BASED INDUSTRIAL PARK, |
| HSINCHU, TAIWAN 30078 |
|
|
|
| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
|
|
|
|
| JCIPRNET |
| P.O. BOX 600 TAIPEI GUTING |
| TAIPEI CITY, 10099 TAIWAN |
|
|
Search Results as of:
05/16/2024 02:14 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
