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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11923312
Issue Dt:
03/05/2024
Application #:
16366661
Filing Dt:
03/27/2019
Publication #:
20200312771
Pub Dt:
10/01/2020
Inventors:
Bai NIE, Gang DUAN, Srinivas PIETAMBARAM, Jesse JONES, Yosuke KANAOKA, Hongxia FENG et al
Title:
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
Assignment: 1
Reel/Frame:
051491/0023Recorded: 01/13/2020Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
NIE, BAI
Exec Dt:
01/03/2020
DUAN, GANG
Exec Dt:
12/27/2019
PIETAMBARAM, SRINIVAS
Exec Dt:
12/27/2019
JONES, JESSE
Exec Dt:
01/02/2020
KANAOKA, YOSUKE
Exec Dt:
12/30/2019
FENG, HONGXIA
Exec Dt:
12/30/2019
XU, DINGYING
Exec Dt:
01/06/2020
MANEPALLI, RAHUL
Exec Dt:
01/07/2020
PAITAL, SAMEER
Exec Dt:
01/02/2020
DARMAWIKARTA, KRISTOF
Exec Dt:
12/27/2019
LI, YONGGANG
Exec Dt:
01/02/2020
JIAO, MEIZI
Exec Dt:
12/26/2019
ZHANG, CHONG
Exec Dt:
12/26/2019
TINGEY, MATTHEW
Exec Dt:
01/02/2020
HAN, JUNG KYU
Exec Dt:
12/30/2019
CHEN, HAOBO
Exec Dt:
12/27/2019
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
JUSTIN K. BRASK
1211 SW 5TH AVENUE, STE. 1600
PORTLAND, OR 97204

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