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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	11569125	Issue Dt:	01/31/2023	Application #:	16912369	Filing Dt:	06/25/2020
Publication #:	20200328113	Pub Dt:	10/15/2020
Inventors:	Allen Ke, Yi-Wei CHIU, Hung Jui CHANG, Yu-Wei KUO
Title:	ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES

Assignment: 1

Reel/Frame:

061022/0970

Recorded: 09/08/2022

Pages: 8

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

KE, ALLEN

Exec Dt:

11/07/2017

CHIU, YI-WEI

Exec Dt:

11/07/2017

CHANG, HUNG-JUI

Exec Dt:

11/07/2017

KUO, YU-WEI

Exec Dt:

01/07/2018

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

NO. 8, LI-HSIN RD. 6

HSINCHU SCIENCE PARK

HSINCHU, TAIWAN 300-78

Correspondent:

STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C

1100 NEW YORK AVE., N.W.

WASHINGTON, DC 20005

Assignment: 2

Reel/Frame:

064293/0523

Recorded: 07/18/2023

Pages: 7

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST NAME OF THE THIRD INVENTOR HUNG-JUI CHANG TO HUNG JUI PREVIOUSLY RECORDED AT REEL: 061022 FRAME: 0970. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.

Assignors:

KE, ALLEN

Exec Dt:

11/07/2017