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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11446851
Issue Dt:
09/20/2022
Application #:
16398164
Filing Dt:
04/29/2019
Publication #:
20200338796
Pub Dt:
10/29/2020
Inventors:
Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu et al
Title:
MOLDING APPARATUS, MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR DEVICE AND MOLDED SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
049249/0158Recorded: 05/22/2019Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WENG, SHENG-FENG
Exec Dt:
04/26/2019
HSIEH, CHING-HUA
Exec Dt:
04/25/2019
LIU, CHUNG-SHI
Exec Dt:
04/25/2019
LIN, CHIH-WEI
Exec Dt:
04/25/2019
CHIU, SHENG-HSIANG
Exec Dt:
04/25/2019
LAI, YAO-TONG
Exec Dt:
04/29/2019
LIN, CHIA-MIN
Exec Dt:
04/26/2019
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 300-78
Correspondent:
JCIPRNET
P.O. BOX 600 TAIPEI GUTING
TAIPEI CITY, 10099 TAIWAN

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