Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/26/2022
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Application #:
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16573775
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Filing Dt:
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09/17/2019
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Publication #:
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Pub Dt:
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10/29/2020
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Inventors:
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Kiyotaka Imai, Hirokazu Aizawa, Hiroshi Maeda, Kaoru Maekawa, Yuji Mimura et al
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Title:
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Method And Structure for Low Density Silicon Oxide for Fusion Bonding and Debonding
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AKASAKA BIZ TOWER |
| 3-1 AKASAKA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 107-6325 |
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| TOKYO ELECTRON U.S. HOLDINGS, INC. |
| 2400 GROVE BLVD. |
| AUSTIN, TX 78741 |
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