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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/20/2023
Application #:
16923211
Filing Dt:
07/08/2020
Publication #:
Pub Dt:
10/29/2020
Inventors:
Shinichiro BANBA, Tadashi NOMURA, Tsuyoshi TAKAKURA
Title:
MODULE WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
053148/0350Recorded: 07/08/2020Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/16/2020
Exec Dt:
06/25/2020
Exec Dt:
06/16/2020
Assignee:
10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI
KYOTO, JAPAN 617-8555
Correspondent:
PEARNE & GORDON LLP
1801 EAST 9TH STREET
SUITE 1200
CLEVELAND, OH 44114-3108

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