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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/18/2022
Application #:
16929291
Filing Dt:
07/15/2020
Publication #:
Pub Dt:
10/29/2020
Inventors:
Tadashi SUGAHARA, Kengo ONAKA, Takaaki ISHII
Title:
A MULTILAYER CIRCUIT BOARD COMPRISING SERIALLY CONNECTED SIGNAL LINES AND STUBS DISPOSED IN DIFFERENT LAYERS OF THE MULTILAYER CIRCUIT BOARD
Assignment: 1
Reel/Frame:
053216/0508Recorded: 07/15/2020Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/02/2020
Exec Dt:
05/07/2020
Exec Dt:
04/30/2020
Assignee:
10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI
KYOTO, JAPAN 617-8555
Correspondent:
PEARNE & GORDON LLP
1801 EAST 9TH STREET
SUITE 1200
CLEVELAND, OH 44114-3108

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