Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
06/08/2021
|
Application #:
|
16911704
|
Filing Dt:
|
06/25/2020
|
|
Publication #:
|
|
Pub Dt:
|
10/29/2020
| | | | |
|
Inventors:
|
Xianglan Wu, Siping Bai, Zhijian Wang, Jinqiang Zhang, Zhigang Yang
|
|
Title:
|
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACTURING METHODS THEREFOR
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| ROOM#8078, 8F, HI-TECH BUILDING, NO. 2 |
| JIAYUAN ROAD, EAST LAKE HI-TECH DEVELOPMENT ZONE |
| WUHAN, CHINA 430074 |
|
|
|
|
| KILPATRICK TOWNSEND & STOCKTON LLP |
| 1100 PEACHTREE STREET |
| SUITE 2800 |
| ATLANTA, GA 30309 |
|
|
Search Results as of:
04/29/2024 05:32 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
