Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/31/2022
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Application #:
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16844341
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Filing Dt:
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04/09/2020
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Publication #:
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Pub Dt:
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11/05/2020
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Inventors:
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Chunlei LIU, Fabian MOHN, Jürgen SCHUDERER
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Title:
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METHOD FOR PRODUCING A SEMICONDUCTOR MODULE BY USING ADHESIVE ATTACHMENT PRIOR TO SINTERING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| INGOLSTADT |
| 85045, GERMANY |
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| BROWN BOVERI STRASSE 6 |
| BADEN, SWITZERLAND 5400 |
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| MAIER & MAIER, PLLC |
| 345 SOUTH PATRICK STREET |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BRUGGERSTRASSE 72, AARGAU |
| BADEN, SWITZERLAND 5400 |
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| MAIER & MAIER, PLLC |
| 345 SOUTH PATRICK STREET |
| ALEXANDRIA, VA 22314 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| BRUGGERSTRASSE 72 |
| BADEN, SWITZERLAND 5400 |
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| MAIER & MAIER, PLLC |
| 345 SOUTH PATRICK STREET |
| ALEXANDRIA, VA 22314 |
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