Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/01/2022
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Application #:
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16758662
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Filing Dt:
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04/23/2020
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Publication #:
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Pub Dt:
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11/12/2020
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Inventors:
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Peng Wei, Fengyi Su, Yan Zhang, Dorab Bhagwagar, Debo Hong, Danhuan Ma, Junmin Zhu
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Title:
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METHOD FOR APPLYING THERMALLY CONDUCTIVE COMPOSITION ON ELECTRONIC COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 WEST SALZBURG ROAD |
| MIDLAND, MICHIGAN 48686 |
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| DANNY CHILDS |
| 2211 H.H. DOW WAY |SSC/1338| |
| MIDLAND, MI 48674 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 936 ZHANGHENG ROAD |
| ZHANGJIANG HI-TECH PARK |
| SHANGHAI, CHINA 201203 |
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| DANNY CHILDS |
| 2211 H. H. DOW WAY |
| SSC 1338 |
| MIDLAND, MI 48674 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 WEST SALZBURG ROAD |
| MIDLAND, MICHIGAN 48686 |
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| DANNY CHILDS |
| 2211 H. H. DOW WAY |
| SSC 1338 |
| MIDLAND, MI 48674 |
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