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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/23/2021
Application #:
16455144
Filing Dt:
06/27/2019
Publication #:
Pub Dt:
11/19/2020
Inventors:
Hongbo ZHU, Yi ZHANG
Title:
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
Assignment: 1
Reel/Frame:
049655/0822Recorded: 07/02/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/19/2019
Exec Dt:
06/19/2019
Assignee:
88 XIFEIHE ROAD, HEFEI COMPREHENSIVE BONDED ZONE, XINZHAN DISTRICT,
HEIFEI, ANHUI, CHINA 230012
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, PC
4000 LEGATO RD., SUITE 310
FAIRFAX, VA 22033

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