Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16642971
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Filing Dt:
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08/04/2020
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Publication #:
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Pub Dt:
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11/26/2020
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Inventors:
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Bin Yuan, Zheng Luo, Min Zhu, Yunguan Xu, Shuyao Peng
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Title:
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High-Reliability Copper Alloy Bonding Wire for Electronic Packaging and Preparation Method Therefor
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 25, SOUTH HUANSHI AVENUE |
| NANSHA DISTRICT |
| GUANGZHOU CITY, GUANGDONG PROVINCE, CHINA 511458 |
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| KRISTEN L. PURSLEY |
| 29 W. LAWRENCE STREET, SUITE 210 |
| PONTIAC, MI 48342 |
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