Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/12/2023
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Application #:
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16990887
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Filing Dt:
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08/11/2020
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Publication #:
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Pub Dt:
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11/26/2020
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Inventors:
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DeokKyung Yang, OhHan Kim, HeeSoo Lee, HunTeak Lee, InSang Yoon, Il Kwon Shim
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Title:
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Semiconductor Device and Method of Forming a 3D Interposer System-in-Package Module
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| PATENT LAW GROUP: ATKINS AND ASSOCIATES |
| 123 W. CHANDLER HEIGHTS ROAD, #12535 |
| CHANDLER, AZ 85248 |
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