Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
05/31/2022
|
Application #:
|
16766259
|
Filing Dt:
|
05/21/2020
|
Publication #:
|
|
Pub Dt:
|
12/03/2020
| | | | |
Inventors:
|
Hiroyoshi Kawasaki, Hiroki Sudo, Takahiro Roppongi, Hiroshi Okada, Daisuke Soma et al
|
Title:
|
SOLDER MATERIAL, SOLDER PASTE, AND SOLDER JOINT
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
23, SENJU-HASHIDO-CHO |
ADACHI-KU, TOKYO, JAPAN 1208555 |
|
|
|
WOLF GREENFIELD & SACKS, P.C. |
600 ATLANTIC AVENUE |
BOSTON, MA 02210 |
|
|
Search Results as of:
04/30/2024 02:50 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|