Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/08/2021
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Application #:
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16426984
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Filing Dt:
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05/30/2019
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Publication #:
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Pub Dt:
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12/03/2020
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Inventors:
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Seungpil Lee, Kwang-Ho Kim
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Title:
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CONNECTIVITY DETECTION FOR WAFER-TO-WAFER ALIGNMENT AND BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5080 SPECTRUM DRIVE, SUITE 1050W |
| ADDISON, TEXAS 75001 |
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| PETER GALLAGHER |
| 2001 JUNIPERO SERRA BLVD., SUITE 515 |
| DALY CITY, CA 94014-3888 |
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