Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16431613
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Filing Dt:
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06/04/2019
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Publication #:
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Pub Dt:
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12/10/2020
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Inventors:
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Makoto Shibuya, Yi Yan, Luu Thanh Nguyen, Daiki Komatsu, Hau Nguyen
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Title:
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REPASSIVATION APPLICATION FOR WAFER-LEVEL CHIP-SCALE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12500 TI BOULEVARD, M/S 3999 |
| DALLAS, TEXAS 75243 |
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| TEXAS INSTRUMENTS INCORPORATED |
| P.O. BOX 655474, MS 3999 |
| DALLAS, TX 75265 |
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