Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/08/2023
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Application #:
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16874392
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Filing Dt:
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05/14/2020
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Publication #:
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Pub Dt:
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12/17/2020
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Inventor:
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Jing-En LUAN
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Title:
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WAFER LEVEL CHIP SCALE PACKAGE HAVING VARYING THICKNESSES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 28 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
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| ZACHARY SAKOI, SEED IP LAW GROUP LLP |
| 701 5TH AVE |
| SUITE 5400 |
| SEATTLE, WA 98104 |
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