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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16437978
Filing Dt:
06/11/2019
Publication #:
Pub Dt:
12/17/2020
Inventors:
Joachim Mahler, Michael Bauer, Christoph Liebl, Georg Meyer-Berg, Georg Reuther et al
Title:
Method and Structure for Supporting Thin Semiconductor Chips with a Metal Carrier
Assignment: 1
Reel/Frame:
050435/0471Recorded: 09/19/2019Pages: 19
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/12/2019
Exec Dt:
06/11/2019
Exec Dt:
06/12/2019
Exec Dt:
09/05/2019
Exec Dt:
06/12/2019
Exec Dt:
06/12/2019
Assignee:
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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