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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
16770305
Filing Dt:
06/05/2020
Publication #:
Pub Dt:
12/24/2020
Inventors:
Takeshi SAKAMOTO, Yoshie TACHIBANA, Shunsuke KOGA
Title:
SOLDER PASTE
Assignment: 1
Reel/Frame:
053187/0029Recorded: 07/13/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/06/2018
Assignee:
23, SENJU-HASHIDO-CHO
ADACHI-KU, TOKYO, JAPAN 120-8555
Correspondent:
FAEGRE DRINKER BIDDLE & REATH LLP (DC)
1500 K STREET, N.W.
SUITE 1100
WASHINGTON, DC 20005-1209
Assignment: 2
Reel/Frame:
052853/0732Recorded: 06/05/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/14/2020
Exec Dt:
05/14/2020
Assignee:
23, SENJU-HASHIDO-CHO
ADACHI-KU, TOKYO, JAPAN 120-8555
Correspondent:
FAEGRE DRINKER BIDDLE & REATH LLP (DC)
1500 K STREET, N.W.
SUITE 1100
WASHINGTON, DC 20005-1209

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