Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/08/2022
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Application #:
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16932838
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Filing Dt:
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07/20/2020
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Publication #:
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Pub Dt:
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12/24/2020
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Inventors:
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Takashi TSUTSUI, Shigenori IMANAKA, Tomohiko FURUTANI
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Title:
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THREE-DIMENSIONAL LAMINATED INTEGRATED CIRCUIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-9-1 HIGASHI-SHIMBASHI |
| MINATO-KU |
| TOKYO, JAPAN 105-7317 |
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| RYUKA USA LLP |
| 111 NORTH MARKET STREET |
| SUITE 300 |
| SAN JOSE, CA 95113 |
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