Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/29/2022
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Application #:
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16903496
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Filing Dt:
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06/17/2020
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Publication #:
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Pub Dt:
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12/31/2020
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Inventors:
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You Ge, Meng Kong Lye, Zhijie Wang, Kabir Mirpuri
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Title:
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POWER DIE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6501 WILLIAM CANNON DRIVE WEST |
| AUSTIN, TEXAS 78735 |
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| NXP USA, INC. |
| 6501 WILLIAM CANNON DRIVE WEST |
| AUSTIN, TX 78735 |
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