Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16967717
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Filing Dt:
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08/05/2020
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Publication #:
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Pub Dt:
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01/07/2021
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Inventors:
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Takahiro YOKOYAMA, Kanta DEI, Takahiro MATSUFUJI, Hikaru NOMURA, Shunsaku YOSHIKAWA
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Title:
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SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, RESIN FLUX-CORED SOLDER AND SOLDER JOINT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO, JAPAN 120-8555 |
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| MYERS WOLIN, LLC |
| 100 HEADQUARTERS PLAZA |
| WEST TOWER, FLOOR 7 |
| MORRISTOWN, NJ 07960-6834 |
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