Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/13/2023
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Application #:
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16979377
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Filing Dt:
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09/09/2020
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Publication #:
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Pub Dt:
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01/07/2021
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Inventors:
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Ji Hye Kim, Jun Hyoung Park, Ki Seung Seo, Sang Hwan Kim, Kyung Jun Yoon
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Title:
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Substrate-Free Adhesive Tape
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 128, YEOUI-DAERO |
| YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
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| LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP |
| 20 COMMERCE DR. |
| CRANFORD, NJ 07016 |
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