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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17029739
Filing Dt:
09/23/2020
Publication #:
20210009473
Pub Dt:
01/14/2021
Inventors:
Kenji YAMADA, Kenichiro TERADA, Nobuhiro SHINOHARA, Shinya KIKUGAWA, Yasuo SHINOZAKI et al
Title:
METHOD OF PRODUCING SiC-Si COMPOSITE COMPONENT AND SiC-Si COMPOSITE COMPONENT
Assignment: 1
Reel/Frame:
053861/0576Recorded: 09/23/2020Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YAMADA, KENJI
Exec Dt:
08/31/2020
TERADA, KENICHIRO
Exec Dt:
08/27/2020
SHINOHARA, NOBUHIRO
Exec Dt:
08/31/2020
KIKUGAWA, SHINYA
Exec Dt:
08/27/2020
SHINOZAKI, YASUO
Exec Dt:
08/28/2020
SUSA, SHUNSUKE
Exec Dt:
08/28/2020
Assignee:
AGC INC.
5-1, MARUNOUCHI 1-CHOME, CHIYODA-KU
TOKYO, JAPAN 100-8405
Correspondent:
MICHAEL D. KAMINSKI
FOLEY & LARDNER LLP
3000 K STREET, N.W., SUITE 600
WASHINGTON, DC 20007

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