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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/16/2022
Application #:
16977577
Filing Dt:
09/02/2020
Publication #:
Pub Dt:
01/14/2021
Inventors:
Kenichi SAWADA, Jiro SHINKAI, So TANAKA, Hirotaka OOMORI
Title:
SEMICONDUCTOR MODULE
Assignment: 1
Reel/Frame:
053672/0508Recorded: 09/02/2020Pages: 19
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/26/2020
Exec Dt:
08/31/2020
Exec Dt:
08/24/2020
Exec Dt:
08/26/2020
Assignee:
5-33, KITAHAMA 4-CHOME, CHUO-KU, OSAKA-SHI,
OSAKA, JAPAN 541-0041
Correspondent:
IPUSA, P.L.L.C
1054 31ST STREET, N.W.
SUITE 400
WASHINGTON, DC 20007

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