Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/23/2024
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Application #:
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17061936
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Filing Dt:
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10/02/2020
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Publication #:
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Pub Dt:
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01/21/2021
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Inventors:
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Daisuke IKEDA, Hiroshi ASAKA, Hideo KITAGAWA, Masayuki ONO
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Title:
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PUNCTURE FORMING METHOD, SAMPLE SEPARATING METHOD, SEMICONDUCTOR ELEMENT MANUFACTURING METHOD, SEMICONDUCTOR LASER ELEMENT MANUFACTURING METHOD, AND SEMICONDUCTOR LASER ELEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, KOTARI-YAKEMACHI, NAGAOKAKYO-SHI |
| KYOTO, JAPAN 617-8520 |
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| MCDERMOTT WILL & EMERY LLP |
| THE MCDERMOTT BUILDING |
| 500 NORTH CAPITAL STREET, N.W. |
| WASHINGTON, DC 20001 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1 KOTARI-YAKEMACHI, NAGAOKAKYO CITY, |
| KYOTO, JAPAN |
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| MCDERMOTT WILL & EMERY LLP |
| THE MCDERMOTT BUILDING |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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04/27/2024 09:53 PM
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