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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16925806
Filing Dt:
07/10/2020
Publication #:
Pub Dt:
01/21/2021
Inventors:
Hideki SUGIYAMA, Shunsuke KANEKO, Akihiro OGASAWARA
Title:
SUBSTRATE SUPPORT ASSEMBLY, SUBSTRATE PROCESSING APPARATUS, AND EDGE RING
Assignment: 1
Reel/Frame:
053174/0787Recorded: 07/10/2020Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/08/2020
Exec Dt:
07/08/2020
Exec Dt:
07/09/2020
Assignee:
3-1, AKASAKA 5-CHOME, MINATO-KU,
TOKYO, JAPAN 107-6325
Correspondent:
IPUSA, P.L.L.C
1054 31ST STREET, N.W.
SUITE 400
WASHINGTON, DC 20007

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