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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/23/2022
Application #:
16982233
Filing Dt:
09/18/2020
Publication #:
Pub Dt:
01/28/2021
Inventors:
Hirokazu KATO, Takafumi YAMASHITA
Title:
METHOD OF ETCHING BORON-DOPED P-TYPE SILICON WAFER, METHOD OF EVALUATING METAL CONTAMINATION OF BORON-DOPED P-TYPE SILICON WAFER AND METHOD OF MANUFACTURING BORON-DOPED P-TYPE SILICON WAFER
Assignment: 1
Reel/Frame:
053817/0383Recorded: 09/18/2020Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/19/2020
Exec Dt:
08/19/2020
Assignee:
1-2-1 SHIBAURA, MINATO-KU
TOKYO, JAPAN 1058634
Correspondent:
GREENBLUM & BERNSTEIN, P.L.C.
1950 ROLAND CLARKE PLACE
RESTON, VA 20191

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