Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16937922
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Filing Dt:
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07/24/2020
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Publication #:
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Pub Dt:
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01/28/2021
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Inventors:
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Yan Yang Zhao, Edwin Loy, Chihhao Chen
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Title:
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WIREBONDABLE INTERPOSER FOR FLIP CHIP PACKAGED INTEGRATED CIRCUIT DIE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 520 PARK EAST BOULEVARD |
| NEW ALBANY, INDIANA 47150 |
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| BAKER & HOSTETLER LLP |
| CIRA CENTRE - 12TH FLOOR |
| 2929 ARCH STREET |
| PHILADELPHIA, PA 19104 |
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