Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
01/18/2022
|
Application #:
|
16942715
|
Filing Dt:
|
07/29/2020
|
|
Publication #:
|
|
Pub Dt:
|
02/04/2021
| | | | |
|
Inventors:
|
Saravuth SIRINORAKUL, Roel Adeva ROBLES, Wing Keung LAM, Kok Chuen LOCK
|
|
Title:
|
STACKED DIES ELECTRICALLY CONNECTED TO A PACKAGE SUBSTRATE BY LEAD TERMINALS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
|
|
|
|
| HORIZON IP PTE LTD |
| 7500A BEACH ROAD |
| #04-306/308 THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
|
|
Search Results as of:
05/30/2024 12:19 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
