Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16729461
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Filing Dt:
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12/29/2019
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Publication #:
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Pub Dt:
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02/11/2021
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Inventors:
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Pei-Ci CHO, Cheng-Wei LEE, Chun-Hung HUANG, Chi-Yen LIN, Min-Chi YANG, Yuan-Li LIAO
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Title:
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TEMPORARY BONDING COMPOSITION, TEMPORARY BONDING FILM, COMPOSITE FILM, TEMPORARY BONDING METHOD AND SEMICONDUCTOR WAFER PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.15, KEYUAN 1ST RD., XITUN DIST. |
| TAICHUNG CITY, TAIWAN 407 |
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| CKC & PARTNERS CO., LLC |
| 12345 LAKE CITY WAY NE, NO. 283 |
| SEATTLE, WA 98125 |
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