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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11145565
Issue Dt:
10/12/2021
Application #:
16897367
Filing Dt:
06/10/2020
Publication #:
20210043532
Pub Dt:
02/11/2021
Inventors:
TUNG-CHUAN WANG, PING-LUNG WANG, HSI-YING YUAN, CHUN-YUAN HOU, Tzu-kuei Wen
Title:
METHOD OF FABRICATING A CHIP PACKAGE MODULE WITH IMPROVE HEAT DISSIPATION EFFECT
Assignment: 1
Reel/Frame:
052889/0685Recorded: 06/10/2020Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YUAN, HSI-YING
Exec Dt:
05/15/2020
WANG, TUNG-CHUAN
Exec Dt:
05/15/2020
HOU, CHUN-YUAN
Exec Dt:
05/14/2020
WANG, PING-LUNG
Exec Dt:
05/19/2020
WEN, TZU-KUEI
Exec Dt:
05/14/2020
Assignee:
YOUNGTEK ELECTRONICS CORPORATION
4F, NO. 5 TECHNOLOGY RD., SCIENCE-BASED INDUSTRIAL PARK,
HSINCHU, TAIWAN 300
Correspondent:
LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE
3057 NUTLEY STREET
SUITE 818
FAIRFAX, VA 22031

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