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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/29/2022
Application #:
16947477
Filing Dt:
08/03/2020
Publication #:
Pub Dt:
02/11/2021
Inventors:
Mikael Tuominen, Seok Kim Tay, Nick Xin
Title:
Semi-Flex Component Carrier With Dielectric Material Surrounding an Embedded Component and Having Locally Reduced Young Modulus
Assignment: 1
Reel/Frame:
054991/0376Recorded: 01/21/2021Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/14/2021
Exec Dt:
01/14/2021
Exec Dt:
01/14/2021
Assignee:
NO. 5000, JIN DU ROAD
XINZHUANG INDUSTRY PARK, MINHANG DISTRICT
SHANGHAI, CHINA 201108
Correspondent:
SMITH TEMPEL BLAHA LLC DOCKETING DEPARTM
50 GLENLAKE PARKWAY, SUITE 340
ATLANTA, GA 30328

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