Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/21/2023
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Application #:
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16541734
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Filing Dt:
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08/15/2019
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Publication #:
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Pub Dt:
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02/18/2021
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Inventors:
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Andrew J. Brown, Sandeep B. Sane, Lauren A. Link, Sheng C. Li
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Title:
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PACKAGE SUBSTRATE WITH REDUCED INTERCONNECT STRESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| FINCH & MALONEY PLLC |
| 50 COMMERCIAL ST. |
| SUITE 300 |
| MANCHESTER, NH 03101 |
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