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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/05/2021
Application #:
16547750
Filing Dt:
08/22/2019
Publication #:
Pub Dt:
02/25/2021
Inventors:
Hsi-Wen Tien, Pin-Ren Dai, Chih Wei Lu, Wei-Hao Liao, Hsin-Chieh Yao, Chung-Ju Lee
Title:
Semiconductor Devices and Methods of Forming the Same
Assignment: 1
Reel/Frame:
054682/0539Recorded: 12/17/2020Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/19/2019
Exec Dt:
08/19/2019
Exec Dt:
08/16/2019
Exec Dt:
08/16/2019
Exec Dt:
08/16/2019
Exec Dt:
08/16/2019
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP (24061) IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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