Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/31/2023
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Application #:
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16548255
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Filing Dt:
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08/22/2019
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Publication #:
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Pub Dt:
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02/25/2021
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Inventors:
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Kaizad MISTRY, Nisha ANANTHAKRISHNAN, Jigneshkumar P. PATEL, Liwei WANG, Xavier F. BRUN et al
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Title:
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WAFER LEVEL PASSIVE HEAT SPREADER INTERPOSER TO ENABLE IMPROVED THERMAL SOLUTION FOR STACKED DIES IN MULTI-CHIPS PACKAGE AND WARPAGE CONTROL
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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JUSTIN K. BRASK |
1211 SW 5TH AVENUE, STE. 1600 |
PORTLAND, OR 97204 |
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