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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/08/2022
Application #:
16958798
Filing Dt:
06/29/2020
Publication #:
Pub Dt:
03/04/2021
Inventors:
Hyeongseob SHIN, Younghyo KIM, Keehae KWON, In-Chol KIM, Jieun PARK
Title:
Thermoplastic Resin Composition Including Maleimide-Based Heat-Resistant Copolymer and Molded Product Using Same
Assignment: 1
Reel/Frame:
053071/0140Recorded: 06/29/2020Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/26/2020
Exec Dt:
06/26/2020
Exec Dt:
06/29/2020
Exec Dt:
06/29/2020
Exec Dt:
06/29/2020
Assignee:
300, OLYMPIC-RO SONGPA-GU
SEOUL, KOREA, REPUBLIC OF 05551
Correspondent:
ADDITON, HIGGINS & PENDLETON, P.A.
10706 SIKES PLACE
SUITE 350
CHARLOTTE, NC 28277

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