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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11164824
Issue Dt:
11/02/2021
Application #:
16865432
Filing Dt:
05/04/2020
Publication #:
20210066211
Pub Dt:
03/04/2021
Inventors:
Tsung-Fu Tsai, Kung-Chen Yeh, Li-Chung Kuo, Szu-Wei Lu, Ying-Ching Shih
Title:
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
Assignment: 1
Reel/Frame:
052594/0162Recorded: 05/07/2020Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TSAI, TSUNG-FU
Exec Dt:
04/15/2020
YEH, KUNG-CHEN
Exec Dt:
04/16/2020
KUO, LI-CHUNG
Exec Dt:
04/16/2020
LU, SZU-WEI
Exec Dt:
04/15/2020
SHIH, YING-CHING
Exec Dt:
04/16/2020
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 300-78
Correspondent:
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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