Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/20/2022
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Application #:
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17098754
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Filing Dt:
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11/16/2020
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Publication #:
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Pub Dt:
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03/04/2021
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Inventors:
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Robert Alan May, Sri Ranga Sai Boyapati, Kristof Kuwawi Darmawikarta et al
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Title:
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PACKAGE SUBSTRATE WITH HIGH-DENSITY INTERCONNECT LAYER HAVING PILLAR AND VIA CONNECTIONS FOR FAN OUT SCALING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| ALISHA FEUSTEL |
| 2816 LAGO VISTA LANE |
| PATENT CAPITAL GROUP |
| ROCKWALL, TX 75032 |
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