Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/17/2023
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Application #:
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16855048
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Filing Dt:
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04/22/2020
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Publication #:
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Pub Dt:
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03/04/2021
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Inventors:
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Hakseung Lee, Ho-Jin Lee, Dong-Chan Lim, Jinnam Kim, Kwangjin Moon
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Title:
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APPARATUS FOR ETCHING SUBSTRATE BEVEL AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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129, SAMSUNG-RO |
YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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MYERS BIGEL, P.A. |
PO BOX 37428 |
RALEIGH, NC 27627 |
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05/22/2024 10:52 AM
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